Sign In | Join Free | My himfr.com
Home > Industrial Silicone Sealant >

SLF385 Silicone Waterproof Potting Compound For Electronics

    Buy cheap SLF385 Silicone Waterproof Potting Compound For Electronics from wholesalers
     
    Buy cheap SLF385 Silicone Waterproof Potting Compound For Electronics from wholesalers
    • Buy cheap SLF385 Silicone Waterproof Potting Compound For Electronics from wholesalers

    SLF385 Silicone Waterproof Potting Compound For Electronics

    Ask Lasest Price
    Brand Name : BAIYUN
    Model Number : SLF 385
    Price : Negotiation
    Supply Ability : Cartridge / Sausage Packaging 1000000PCS/month; Drum Packaging 10000 Kits / month;
    Delivery Time : 7-14 days
    • Product Details
    • Company Profile

    SLF385 Silicone Waterproof Potting Compound For Electronics

    SLF385 Silicone Encapsulant Potting Compound 25KG / Drum


    DESCRIPTION

    SLF385 silicone 1 to 1 encapsulants are supplied as two-part liquid component kits. When liquid components are throughly mixed, the mixture cures to a flexible elastomer, which is well suited for the protection of electrical/electornic applications.

    KEY FEATURES

    ◆ Low viscosity and good flowability for fast processing

    ◆ Good thermal conductivity

    ◆ Room temperature curing and accelerated cured by heat

    ◆ UL 94 V0 certified

    APPLICATIONS

    ◆ Power modules,inverters,ballasts,adaptors

    ◆ Electric control units and sensors

    ◆ LED lightings

    ◆ Other electric units product

    TYPICAL PROPERTIES

    PropertyTypical ValueTest Method
    Part APart B
    Appearance(color)Dark GrayWhiteVisual
    Specific Gravity1.59±0.021.60±0.02ASTM D792-2013
    Viscosity,25℃3000~4000cp/25℃3000~4000cp/25℃ASTM D2196-2015
    Mixing Ratio1:1/
    Mixture
    Viscosity,25℃3200~3600cp/25℃ASTM D2196-2015
    Pot Life,25℃45min/25℃/
    Cure Time,25℃7~8h/25℃/
    Cured Elastomer
    AppearanceDark Gray Elastomer/
    Hardness55±3 ShoreAASTM D2240-2015
    Tensile Strength1.5MpaASTM D412-2006
    Elongation at Break60%ASTM D412-2006
    Thermal Conductivity0.68W/m·KISO22007.2-2015
    UL94 Flame ClassificationV0UL94
    Dielectric Strength18KV/mmASTM D149-2009
    Dielectric Constant3.5/1MHzASTM D150-2018
    Dielectric Factor0.01/1MHzASTM D150-2018
    Volume Resistivity1.4×1014W·cmASTM D257-2007
    Linear CTE200um/m·℃ASTM D696-2016
    Operating Temperature-45~180℃/

    Specifications: Typical property data values should not be used as specifications.

    APPLICATION METHODS

    PREPARING

    Before mixing, Part A and Part B should be agitated well to obtain uniform elastomer. Care should be taken to minimize air entrapment.

    MIXING

    Thoroughly mix Part A and Part B in a ratio of 1:1 by weight. The liquid mixture should have a uniform appearance. The presence of light-colored streaks of marbling indicates inadequate mixing and will result in incomplete cure. It can be automated mixing or manual mixing.

    DEFOAMING

    When practical, pouring/dispensing should be done under vacuum, particularly if the component being potted or encapsulated has many small voids.

    CURING

    Cure reaction begins with the mixing process. Initially, the mixture of Part A and Part B can be poured/dispensed directly into the container in which it is to be cured. Cure is evidenced by a gradual increase in viscosity, followed by gelation and conversion to a solid elastomer. Pot life is sensitive to environmental temperature.

    COMPATIBILITY

    Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of SLF385 silicone encapsulant. Most notable of these include:

    ◆ Organotin and other organometallic compounds

    ◆ Silicone rubber containing organotin catalyst

    ◆ Sulfur, polysulfides, polysulfones or other sulfurcontaining materials

    ◆ Amines, urethanes or amine-containing materials

    ◆ Unsaturated hydrocarbon plasticizers

    ◆ Some solder flux residues

    If a substrate or material is questionable with respect to potentially causinginhibition of cure, it is recommendedthat a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.

    REPAIRABILITY

    SLF385 silicone encapsulant can be selectively removed with relative ease, any repairs or changes accomplished, and the repaired area repotted in place with additional product.

    PACKING INFORMATION

    SLF385 silicone 1:1 mix ratio encapsulants are available in 25kg/25kg plastic tub by set.

    USABLE LIFE AND STORAGE

    When stored at or below 27℃ in the original unopened containers, this product has a usable life of 9 months from the date of production.

    HANDLING AND SAFETY

    PRODUCT SAFETY INFORMATION REQUIRED FOR SAFE USE IS NOT INCLUDED IN THIS DOCUMENT. BEFORE HANDLING, READ PRODUCT AND MATERIAL SAFETY DATA SHEETS AND CONTAINER LABELS FOR SAFE USE, PHYSICAL AND HEALTH HAZARD INFORMATION. THE MATERIAL SAFETY DATA SHEET IS AVAILABLE FROM BAIYUN SALES APPLICATION ENGINEER, OR DISTRIBUTOR, OR BY CALLING BAIYUN CUSTOMER SERVICE.


    The values in this document are not of all specifications and are subject to change without notice. As the actual situation is very different, it’s hard to guarantee the correctness and applicability of our products in some usage. Users should understand the product before using, and then decide the best way to use it.

    Quality SLF385 Silicone Waterproof Potting Compound For Electronics for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: GUANGZHOU BAIYUN TECHNOLOGY CO., LTD.
    *Subject:
    *Message:
    Characters Remaining: (0/3000)